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HW News – False "leaks" from Intel to Comet Lake, Ryzen price cuts 2000 | Nexus player

That slide from Intel "Comet Lake" is false

Last week saw the release of a slide from "Processor Details" that was supposed to be from Intel, including promises of a large number of new Comet Lake CPUs, high core counts, competitive prices and high frequencies. Although Intel Corporation does not comment on rumors, we talk to sources close to the matter and confirm that this is not done by Intel and that it is a false slide. At this time, it is probably better to know that yes, new CPUs will come out, but we do not know the specifications at this time. Like rumors of 5 GHz Ryzen CPUs for Zen2, it is likely that they will only be ignored until we get close to the launch; There are more realistic leaks from board members, rather than invented slides.

Source: GN

The new interconnection and packaging of Intel

As the monolithic approach to chip construction becomes more complex and limited by physics, both AMD and Intel have adopted a chiplet approach. At Semicon West, Intel pulled the member out of the new packaging and interconnect technologies that, according to the chip maker, will take chip designs into the future.

The new packaging technology from Intel is called Co-EMIB, and essentially combines the integrated interconnection of multiple matrices (EMIB) and the Foveros. If you remember, Intel debuted with EMIB in 2017 when it announced a partnership with AMD to bring Intel processors to the market with Radeon graphics. That partnership resulted in the Kaby Lake G chip with the Radeon Vega graphics, which propelled the NUC of Hades Canyon that we tested and overclocked extensively.

However, Foveros arrives relatively late, but was announced late last year. Foveros is a 3D chip stacking technology, which results in what Intel calls x86 hybrid processors. The chips that use Foveros are scheduled to debut in the 10nm Lakefield lineup from Intel. By using Foveros and EMIB, therefore, Co-EMIB, Intel states that it allows "further uniting performance and computing capacity". In addition to connecting multiple elements of Foveros, designers can also link other "mosaics" (see: chiplets) such as badog or memory components.

Then there is the new omnidirectional interconnection (ODI). ODI is a communications framework that combines the horizontal communication of EMIB and the vertical communication of Foveros. ODI uses large silicon channels (TVS) to communicate and deliver power vertically through the base. Larger TVs offer less resistance and facilitate greater bandwidth. This approach also means that Intel can use fewer televisions, optimizing space.

Finally, Intel discussed a new die to the interface, known as MDIO. MDIO is more of a modular system that consists of an intellectual property block library, and is based on the PHY level interconnection of the Intel Advanced Interface Bus (AIB).

Source: https://newsroom.intel.com/news/intel-unveils-new-tools-advanced-chip-packaging-toolbox/#gs.o0fdri

Intel hires a VMware communications officer

Intel has hired Claire Dixon as corporate vice president and communications director (CCO). Intel's new Dixon feature came into effect on July 1, where it will report to Michelle Johnston Holthaus, senior vice president and general manager of Intel's sales and marketing group and interim CMO, according to Intel. Dixon will be responsible for Intel's global communications organization, including corporate communications and events, product public relations, employee communications and badyst relationships.

Dixon previously worked for VMWare, where he served as senior vice president and communications director. Prior to that, Dixon was vice president of global communications at ebay.

Source: https://newsroom.intel.com/news-releases/intel-appoints-claire-dixon-corporate-vice-president-chief-communications-officer/#gs.oc45mp

Ryzen 2000 and 2nd-Gen Threadripper Get price cuts

Following the launch of AMD's Ryzen 3000, prices have been significantly reduced in the Ryzen 2000 chips. Today, the Ryzen 5 2600X is selling $ 160 on Amazon, with a fairly low price of $ 260 MSRP. Meanwhile, the Ryzen 5 2600 costs $ 140, or approximately $ 60 of its launch price of $ 200. Finally, the flagship Ryzen 7 2700X has been reduced to $ 249, while it was launched with a price of $ 330.

The second generation of Threadripper AMD is also getting its own price cuts. With the Ryzen 9 3900X invading the bottom rung of the Threadripper 2000 product stack, it makes sense for AMD to lower the prices of the Threadripper 2950X and the Threadripper 2920X. When the Ryzen 9 3950X debuts in September, these price drops will make even more sense, since the chip will no doubt further cannibalize the Threadripper's load.

The Threadripper 2950X is currently trading at $ 730, well south of its launch price of $ 899. Alternatively, the AMD Threadripper 2920X will cost $ 340 at B & H. The 2920X debuted at $ 649.

Source: https://www.tomshardware.com/news/amd-ryzen-5-2600x-ryzen-7-2700x-amazon-deal,39812.html


Galaxy Rolls-Out PCIe 4.0 SSD with 500 GB option

There are already some PCIe 4.0 SSDs on the market, all based on the Phison PS5016-E16 controller. So far, we know models of Gigabyte, Corsair and Sabrent. Now, Galax is ready to enter the PCIe 4.0 field even without crowds. As with previous SSDs based on the new PCIe 4.0 standard, the new HOF Pro from Galax will use the Phison controller PS5016-E16, and the 96-layer 3D from Toshiba. TLC NAND.

The Galax HOF Pro will be based on the M.2 2280 form factor and pbadively cooled with an aluminum heat sink. The Galax HOF Pro will be able to differentiate a bit by offering a capacity option of 500 GB. The sequential read / write speeds vary by model, but the 2TB offers tops out at 5GB / s read and 4.4GB / s write, which is in line with the paper specifications seen on other PCIe 4.0 SSDs.

While there are no prices, the units are expected to reach the retail channels by the end of the month.

Source: https://www.tomshardware.com/news/galax-hof-pro-m.2-pcie-4.0-ssd,39826.html

Samsung's EU-5nm 5nm LP node is progressing

Samsung recently confirmed that its foundry has certified full flow tools from both Cadence and Synopsys. The new tools will be used for chip designs based on Samsung's 5nm 5LPE (Low Power Early) node. Samsung certified both the full-flow design tools of the Cadence full-flow digital solution and the Synopsys Fusion design platform that uses the Arm Cortex-A53 and Arm Cortex-A57 cores.

"As part of our long-standing collaboration with Cadence, we have confirmed that its full digital flow meets and exceeds the requirements for designing with 5LPE process technology," said Jung Yun Choi, vice president of Design Technology Team at Samsung Electronics.

Separately, Choi also commented on Samsung's collaboration with Synopsys. "Synopsys continues to be our preferred supplier for collaboration in new development and licensing, so our foundry customers can confidently increase their designs to volume production in all market segments, including automotive, artificial intelligence, computing High performance and mobile devices. "

According to Anandtech, recently certified tools include compilers, validators, power circuit optimizers and EUV-specific tools.

Source: https://www.anandtech.com/show/14620/samsungs-5nm-euv-technology-gets-closer-tools-by-cadence-synopsys-certified



Custom Navi cards in mid-August

In our review of AMD Radeon RX 5700 XT, we have a major problem with defective drivers and poor thermal conditions. The forms will (eventually) be arranged by AMD, and the laughter will fall on the AIB partners. AMD Navi GPUs suffer from an insufficient and too common blower style cooler. Needless to say, there is plenty of space for AIB partners to innovate with customized cooling solutions.

According to Scott Herkelman, vice president and general manager of Radeon, personalized Navi cards will not be here until mid-August. "Hello everyone, Custom AIB designs will hit the market ~ in mid-August," Herkelman said through a Reddit thread. He also offered some justification for the type of fan fan.

"The Radeon group has historically had a reputation for producing product launch graphics that do not match real-world performance. I love it or hate it The blower allowed us to guarantee the performance in each system to match our launch tables. Not everyone cools their PC as well as a critic and, definitely, not as good as some of the images you have shared. My goal was to clean all this so you can trust our performance you hear from us on stage. "

Also, you can see how we fix the RX 5700 XT refrigerator.

Source: Scott Herkelman, Vice President and General Manager of Radeon,

through Reddit – https://www.reddit.com/r/Amd/comments/catck3/psa_5700_series_custom_aib_designs/?utm_source=share&utm_medium=ios_app

MSI updates the plates of the AM4 400 series with 32MB BIOS chips

With AMD's growing family of processors, compatibility with older versions of AM4 socket boards is becoming a challenge for some motherboard vendors. In particular, MSI has problems with the 16MB BIOS chips on the 300 and 400 series motherboards. To solve this, MSI is relaunching the AM4 400 series cards with 32MB chips to better adapt to microcode updates and storage.

The new boards will have the identifier "Max" attached, as reported by the Polish site PurePC and Tom's Hardware.



  • B450M-A Pro Max
  • B450M Pro-VDH Max
  • B450 Gaming Plus Max
  • B450M Pro-M2 Max
  • B450M Mortar Max
  • B450 Tomahawk Max
  • B450-A Pro Max


  • X470 Gaming Pro Max
  • X470 Gaming Plus Max

It is not clear if any other model will get the larger BIOS chips, or if MSI will update the BIOS chips on the 300 series boards.

Source: https://www.tomshardware.com/news/msi-amd-400-motherboards-ryzen-3000,39836.html


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Video: Keegan Gallick
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